Copper Progressive Die Stamping HRC20 - 94 250000 - 300000 Shots Lifespan
Foam Packing Progressive Die Stamping Puching Electronical Products Parts
SHIPPING&Delivery
DHL & UPS& FEDEX, by sea, air or as your request.
Accuracy& Precision:
Roundness: Within 0.001mm,
Straightness: Within 0.002mm,
Surface Roughness: Ra0.4 um
Precision Grinding: 0.001mm
Hardness: HRC20- 94 ( as your request)
Standard: JIS, DIN, AISI
| Product Name |
Foam Packing Progressive Die Stamping Puching Electronical Products Parts |
| Material |
Steel or as request |
| Finish |
Polishing/ mirror polishing/ plating/ heat treatment or according to your mould parts |
| Main Equipment |
CNC high speed center, Precision grinding, WEDM |
| Price |
Estimate by customers drawing |
| MQQ |
1 Pcs |
| Tolerance |
+/- 0.002mm |
| QC |
100% inspection |
Feature of the Parts:
1. CNC machine and Grinding machine make the parts to be ground into different shapes.
2. Semicon-pin Series for Semiconductor Packaging Mould Various of precision semicon-pin series include return pins, side pins, location pins, pkg fix pins, pkg moved pins.
3. Pins with chrome coating, with 0.08 surface smooth, which can only be achieved by mirror polishing, and the plat shape by precision grinding.
4. Special ordered foam packaging box used to ensure pins in good condition.
Tooling material: SKD11, Cr12mov, DC53
Application:
Medical device parts,
Auto parts,
Electronical products,
Household application, etc
